Specification Introduction

Copyright © Quectel Wireless Solutions Co., Ltd. 2026. All rights reserved.


Notes: Unless otherwise specified, the (*) marked after module functions, features, interfaces, pin names, commands, parameters, etc. indicates that the corresponding function, feature, interface, pin, command, parameter, etc. is under development and thus not supported for the time being; the asterisk (*) marked after the module model indicates that no sample is available for this model for the time being.

Specifications

Category Quectel Pi M1 Description Quectel Pi L1 Description
encapsulation

PCBA
Dimensions (mm)

(85 ± 0.2) × (56 ± 0.2) × (21.66 ± 0.2)
Weight (g)


Key Parameters

Category Quectel Pi M1 Quectel Pi L1
Application Processor Octa-core 64-bit ARM Kryo™ 260 processor:
4 × A73 @ 2.0 GHz, 1 MB L2 cache
4 × A53 @ 1.8 GHz, 512 KB L2 cache
ARM Quad-Core 64-bit: 4 × A53 @ 2.0 GHz
GPU 64-bit Adreno™ 610 @ 1050 MHz Adreno™ 702 @ 845 MHz
storage 64 GB eMMC + 4 GB LPDDR4X 2 GB LPDDR4X + 32 GB eMMC
Operating System Yocto Linux(Kernel 5.15) / Debian13 / Android14
USB interface 1 × USB 3.0 Type-C port, with a maximum data transfer rate of up to 5 Gbps, used for firmware flashing (requires BOOT pin shorting) and host mode communication
2 × standard USB 3.0 Type-A ports, host mode only, with a maximum data transfer rate of up to 5 Gbps
2 × standard USB 2.0 Type-A ports, host mode only, with a maximum data transfer rate of up to 480 Mbps
1 × USB Type-C port, main power supply port
SIM interface 2 ×(U) SIM interfaces, 1.8/2.95 V SIM card, dual SIM dual standby (Nano SIM and eSIM)
show interfaces 1 × Micro HDMI port, HDMI 1.4 (frame rate*),
Encoding: 1080P (H.264/H.265) @ 60 fps*),
Decoding: 1080P (H.264/H.265/VP9) @ 60 fps*)
1 × Micro HDMI port, HDMI 1.4 (frame rate*),
Encoding: 1080P (H.264/H.265) @ 60 fps*),
Decoding: 1080P (H.264/H.265/VP9) @ 60 fps*)
1 × FPC connector, FHD+(1080 × 2520) @ 60 fps based on MIPI standard* 1 × FPC connector, HD+(1680 × 720) @ 60 fps based on MIPI standard*
Audio Interface 1 × SH1.0-4P, Audio Interface
1 × Micro HDMI Port, Audio Output*
1 × MEMS Microphone
Camera Interface 2 × FPC connectors, 4-lane MIPI CSI, with a maximum data rate of up to 2.5 Gbps per lane
Ethernet interface 1 × Standard RJ45 port, 10/100/1000 Mbps Ethernet, with POE function supported
SD interface 1 × SD 3.0,4-bit SDIO
UART interface 2.54 mm pin header (1 × 3 pins), for debugging only
expansion interface 4 × I2C interfaces (multiplexed with other interfaces)
3 × SPI interfaces (multiplexed with other interfaces, master mode only)
4 × UART interfaces (multiplexed with other interfaces)
28 × GPIO interfaces (multiplexed with other interfaces)
Key Interface 1 × PWRKEY, internal pull-up
LED indicator Blue and green
Antenna Interface 1 x MAIN, Main Antenna
1 x DRX, Diversity Receive Antenna
1 x GNSS, GNSS Antenna
1 × Wi-Fi/BT, Wi-Fi and Bluetooth Antenna
LTE Compliant with 3GPP Rel-10 FDD and TDD
GNSS GPS, GLONASS, BDS, Galileo, QZSS and SBAS positioning systems
WLAN Operating Mode: AP and STA
Operating Frequency: 2.4 GHz, 5 GHz
Bluetooth Bluetooth Core Specification Version 5.0
Classic Bluetooth and Bluetooth Low Energy (BLE)
Temperature Range Normal operating temperature: 0 ~ + 70 °C
Storage temperature: -40 ~ + 90 °C
Power supply requirements USB Type-C power supply, an 18 W power adapter supporting the PD protocol is recommended
Shield cover None
Firmware Upgrade USB0
OTA
RoHS All components fully comply with the EU RoHS Directive

Note: Micro HDMI port and MIPI display are mutually exclusive ( either one of the two can be supported, not both).

Functional Block Diagram

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Interface Description

Detailed Interface Diagram

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Interface Description Table

Serial No.

Interface Name

Description

1

2 × 20 Pin Header

GPIO with multiple multiplexing functions, which can be multiplexed as I2C, SPI, etc.

2

SD card interface

SD + Nano SIM 2-in-1 pluggable card slot, compliant with SD 3.0 protocol

2

(U) SIM Card Interface

SD + Nano SIM 2-in-1 pluggable card socket, compatible with 1.8/2.95 V (U) SIM cards

3

eSIM card interface

Flip-type eSIM (MFF2) card holder, 1.8/2.95 V eSIM

4

DSI Display Interface

1-lane 4-lane MIPI DSI, with a maximum data rate of up to 1.5 Gbps/lane, supporting FHD+(1080 × 2520) @ 60 fps* based on the MIPI standard

5

Automatic power-on switch

After being turned on, the powered device will automatically start up.

6

PWRKEY button

Power button

7

USB Type-C Power Supply

Provides DC power via USB Type-C and supports PD

8

USB Type-C

USB 3.0 Type-C Port

9

MEMS Input

MEMS microphone

10

HDMI port

HDMI interface video output, 1080P @ 60 Hz

11

Camera Interface

2-lane 4-lane MIPI CSI, with a maximum data rate of up to 2.5 Gbps per lane

12

POE interface

2 × 2 Pin header, PoE power output

13

Ethernet interface

10/100/1000 Mbps Ethernet

14

USB Type-A 3.0

2 standard USB 3.0 Type-A ports

15

USB Type-A 2.0

2 standard USB 2.0 Type-A ports

16

DBG Interface

1 × 3 Pin Header

17

ADC interface

SH1.0-4P interface, 2-channel ADC input, with an input voltage range of 0 to 5.0 V

18

Audio input and output interface

SH1.0-4P interface, audio input and output

19

GNSS Antenna Interface

IPEX-4TH Test Socket

20

Diversity Antenna Interface

IPEX-4TH Test Socket

21

Main Antenna Interface

IPEX-4TH Test Socket

22

Wi-Fi/Bluetooth Antenna Interface

IPEX-4TH Test Socket

Note

The L1 module only supports the use of ADC0.

Mechanical Dimensions

This section mainly introduces the mechanical dimensions of the product, and all dimensions are in mm. For all dimensions without specified tolerances, the tolerance shall be + 0.10/-0.15.

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Electrical Characteristics

Absolute Maximum Ratings

parameter

minimum value

maximum value

Unit

USB Type-C Supply Voltage

-0.3

20

V

Voltage of digital pins on expansion port

-0.3

3.6

V

Note: Exceeding the usage conditions specified in the table above may cause permanent damage to the product.

Power Supply Rating

The product is powered via the POWER IN Type-C port and supports the USB PD 3.0 fast charging protocol. The power adapter used to supply power to the product must be capable of delivering an output of 5 V/5 A or higher.

Characteristics of Digital Logic Levels

2 × 20-pin I/O Requirements (Unit: V)

parameter

Description

minimum value

maximum value

VIH

Input High Level

2.81

3.3

VIL

Input Low Level

0

0.66

VOH

Output high level

3

3.3

VOL

Output low level

0

0.3

Electrostatic Discharge Protection

Static electricity generated by factors such as human body static electricity and charged friction between microelectronic components will discharge to products through various channels, which may cause certain damage to the products. Therefore, due attention shall be paid to electrostatic protection and reasonable electrostatic protection measures shall be taken. For example, wear anti-static gloves during processes such as research and development, production, assembly and testing; when designing products, add anti-static protection devices at circuit interfaces and other points vulnerable to electrostatic discharge. ESD withstand voltage (temperature: 25 ~ 30 ℃, humidity: 40 ± 5 %; unit: kV).

Test Point

contact discharge

air discharge

VBAT and GND

Other Interfaces

Operating and Storage Temperature

Operating and storage temperature (unit: ℃)

parameter

minimum value

Typical Value

maximum value

Normal operating temperature

0

25

70

Storage Temperature

-30

90

Physical Image of M1

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Physical Picture of L1

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